Summary

•To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.

Job

• Develop and optimize electroplating, seed etching, and PR stripping processes

• Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation

• Evaluate and introduce new materials and equipment for plating/etching process integration

• Conduct pre-production process validation and yield stabilization

• Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)

• Develop customized processes and provide technical support for customer programs

• Set up equipment and optimize operating conditions in coordination with vendors

• Troubleshoot quality issues across plating and etching processes

• Support development of advanced packaging technologies including 2.5D, fan-out, and SiP

• Supports high-volume semiconductor packaging processes in plating and etching

• Contributes directly to process yield, quality improvement, and customer technical satisfaction

• Drives technical innovation in advanced packaging technologies in alignment with global customer programs

Requirement

• Bachelor’s degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials)

• Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing

• Fundamental understanding of advanced semiconductor fabrication and integration processes

• Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting

• Proficiency in preparing technical documentation and delivering presentations

• Ability to communicate technical content clearly in English (written and verbal)

• Basic knowledge of semiconductor process equipment and materials

• Experience in key back-end processes such as TSV, RDL, and micro bump

• Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip

• Familiarity with related processes such as photo, chip attach, and underfill

• Proven experience in joint development projects with global customers

• Hands-on collaboration with material or equipment suppliers for co-evaluation or integration

• Expertise in process reliability testing (e.g., thermal cycling, HAST)

• Experience in process automation or smart fab environments

• Working proficiency in tools such as AutoCAD or ANSYS

• In-depth understanding of etch/strip conditions for back-end photoresist materials

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

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